R3 Solutions and NXP Semiconductors to Showcase Campus Networking Devices at Hannover Messe 2024

Berlin, Germany, April 2024

R3 Solutions, a leading provider of industrial wireless solutions, announced today that it will participate in Hannover Messe 2024, where it will showcase its affordable industrial campus network device operating in the 3.7GHz–3.8GHz frequency range (Campus Band). The company aims to demonstrate how its innovative technology bridges the gap between affordability and reliability in industrial wireless connectivity.

R3 Solutions will present its prototype industrial campus network device and its proven Bridge E device, which operates in the unlicensed spectrum. Both solutions offer reliable and cost-effective wireless connectivity for businesses across various industries, including automotive and intralogistics.

At Hannover Messe 2024, R3 Solutions will showcase its expertise and partnerships at two booths in Hall 014. The company will demonstrate its prototype for an industrial campus network in collaboration with NXP Semiconductors at Booth H06/55 and will exhibit at Booth H06/28 in collaboration with the VDMA (German Engineering Federation).

If you’d like to learn more about R3 Solutions’ cost-effective industrial campus network devices and its proven wireless connectivity solutions, visit the booths at the 2024 Hannover Messe.

Headquartered in Berlin, R3 Solutions is a provider of high-performance wireless solutions for industrial data transmission in various machine-to-machine communication applications, including secure AGV control, emergency stop functionality, and secure PLC communication. With 8 years of experience and a proven track record in the unlicensed spectrum, R3 Solutions is committed to providing reliable, affordable, and easy-to-implement connectivity for companies across various industries.

R3’s EchoRing technology combines the reliability of a wired connection with the flexibility of a wireless network and achieves latency of less than five milliseconds. This is made possible by strong partnerships with global players at the silicon and system levels, including Texas Instruments, NXP, Nordic Semiconductors, u-blox, Conductix-Wampfler, and Rockwell Automation.