R3 Solutions & NXP Semiconductors to showcase campus network device at Hannover Messe 2024
Berlin, Germany, April 2024
R3 Solutions, a prominent provider of industrial wireless solutions, today announced its participation in Hannover Messe 2024, where it will showcase its affordable industrial campus network device operating in the 3.7GHz-3.8GHz frequency range (Campus Band). The company aims to demonstrate how its innovative technology bridges the gap between affordability and reliability in industrial wireless connectivity.
R3 Solutions will present its prototype industrial campus network device and its proven Bridge E device, which operates in the unlicensed spectrum. Both solutions offer reliable and cost-effective wireless connectivity for businesses across various industries including automotive and intralogistics.
"Our prototype industrial campus network device and Bridge E are game-changers for industries seeking reliable and fast wireless connectivity without breaking the bank."
At Hannover Messe 2024, R3 Solutions will showcase its expertise and partnerships at two booths in Hall 014. The company will demonstrate its prototype industrial campus network device in collaboration with NXP Semiconductors at stand H06/55 and exhibit at a stand H06/28 in partnership with VDMA (German Engineering Federation).
To learn more about R3 Solutions' affordable industrial campus network device and its proven wireless connectivity solutions, visit their booths at Hannover Messe 2024.
About R3 Solutions
R3 Solutions, based in Berlin, is a provider of high-performance wireless solutions for industrial data transmission in various machine-to-machine communication applications, including safe AGV control, emergency stop functionality, and safe PLC communication. With 8 years of experience and a proven track record in unlicensed spectrum, R3 Solutions is committed to delivering reliable, affordable, and easy-to-implement connectivity to businesses across various sectors.
R3's EchoRing technology combines the reliability of a wired connection with the flexibility of a wireless network, achieving latencies of less than five milliseconds. This is made possible through strong partnerships with global players at the silicon and systems level, including Texas Instruments, NXP, Nordic Semiconductors, u-blox, Conductix-Wampfler, and Rockwell Automation.
For further information, please contact:
Bogdan Slobodian
Product Marketing Manager
Mail: bogdan.slobodian@r3.group